Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints
- Sri Harini Rajendran
- , Do Hyun Jung
- , Jae Pil Jung
- University of Seoul
- Lightweight New Materials Technology Center
Research output: Contribution to journal › Article › peer-review
15
Scopus
citations