TY - JOUR
T1 - Jitney parallel optical interconnect
AU - Crow, John D.
AU - Choi, Joong ho
AU - Cohen, M. S.
AU - Johnson, Glen
AU - Kuchta, Dan
AU - Lacey, Diane
AU - Ponnapalli, Salia
AU - Pepeljugoski, Petar
AU - Stawiasz, Kevin
AU - Trewhella, Jean
AU - Xiao, Peter
AU - Tremblay, Stephane
AU - Ouimet, Sylvain
AU - Lacerte, Andre
AU - Gauvin, Marco
AU - et al, al
PY - 1996
Y1 - 1996
N2 - The Jitney Parallel Optical Interconnect consists of a transmitter module, a receiver module, and a cable capable of sending 1 GigaByte/sec over 1-100 meter spans. This technology has been developed to be cost competitive with copper bus technology, while still offering all the features of optical interconnects. Jitney has a two Byte wide interface with extra lines for clocking and flow control, each line supporting 500 Mb/sec. The modules use a standard logic level (LVDS) and power supply (+3.3v), and mount on standard PC cards using standard vapor phase soldering processes. The ribbon cable connector plugs directly to the module. The transmitter module contains a VCSEL array chip with 20 emitters, driven by a 20 channel CMOS driver IC. The receiver module contains a 20 channel GaAs MESFET receiver array OEIC. Each module also contains a 20 channel plastic molded optical coupler to transfer light to and from the chips to the fibers in a fiber array connector. The modules themselves are plastic molded leadframes, with the optical alignment features for the optical coupler and the array connector molded into the module housing. The cable consists of a 20 fiber ribbon of a 200 μm core fiber of either step or graded index of refraction profile. The entire package has assembly tolerances in the ±50μm range, and thus is assembled using passive alignment techniques. Test vehicle driver and receiver chips indicate the necessary speed, sensitivity, and uniformity for optical bus operation.
AB - The Jitney Parallel Optical Interconnect consists of a transmitter module, a receiver module, and a cable capable of sending 1 GigaByte/sec over 1-100 meter spans. This technology has been developed to be cost competitive with copper bus technology, while still offering all the features of optical interconnects. Jitney has a two Byte wide interface with extra lines for clocking and flow control, each line supporting 500 Mb/sec. The modules use a standard logic level (LVDS) and power supply (+3.3v), and mount on standard PC cards using standard vapor phase soldering processes. The ribbon cable connector plugs directly to the module. The transmitter module contains a VCSEL array chip with 20 emitters, driven by a 20 channel CMOS driver IC. The receiver module contains a 20 channel GaAs MESFET receiver array OEIC. Each module also contains a 20 channel plastic molded optical coupler to transfer light to and from the chips to the fibers in a fiber array connector. The modules themselves are plastic molded leadframes, with the optical alignment features for the optical coupler and the array connector molded into the module housing. The cable consists of a 20 fiber ribbon of a 200 μm core fiber of either step or graded index of refraction profile. The entire package has assembly tolerances in the ±50μm range, and thus is assembled using passive alignment techniques. Test vehicle driver and receiver chips indicate the necessary speed, sensitivity, and uniformity for optical bus operation.
UR - http://www.scopus.com/inward/record.url?scp=0029699608&partnerID=8YFLogxK
M3 - Conference article
AN - SCOPUS:0029699608
SN - 0569-5503
SP - 292
EP - 300
JO - Proceedings - Electronic Components and Technology Conference
JF - Proceedings - Electronic Components and Technology Conference
T2 - Proceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC
Y2 - 28 May 1996 through 31 May 1996
ER -