@inproceedings{a6effad1ecf547658744f22025c10802,
title = "Joint Properties and Thermomechanical Reliability of Nanoparticle-Added Sn-Ag-Cu Solder Paste",
abstract = "Joint properties of a La2O3-nanoparticle-Added Sn-3.0wt%Ag-0.5wt%Cu (SAC305) solder were investigated in this study. Nano-composite solders which contain second-phase nanoparticles in the solder matrix are known to possess high mechanical strength and creep resistance. In this study, La2O3 nanoparticles were mixed with a Sn-Ag-Cu solder paste and the solder joint properties as well as the process ability was evaluated in this study. The slump properties of the nano-composite solder paste was similar to that of the conventional solder paste. The La2O3-Added SAC305 nano-composite solder paste had higher spread area than conventional SAC305 solders. The nanocomposite solder paste had higher toughness than the conventional solder paste. The La2O3-added SAC305 solder paste also showed excellent thermal shock resistance compared with the conventional SAC305 solder.",
keywords = "La2O3, Nano-composite, Printing, Reliabiltiy, Sn-Ag-Cu, Solder, Toughness",
author = "Kim, {Kyoung Ho} and Sehoon Yoo and Jonghyuk Yoon and Songhee Yim and Baek, {Bum Gyu} and Yoon, {Jong Hyun} and Dohyun Jung and Jung, {Jae Pil}",
note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 66th IEEE Electronic Components and Technology Conference, ECTC 2016 ; Conference date: 31-05-2016 Through 03-06-2016",
year = "2016",
month = aug,
day = "16",
doi = "10.1109/ECTC.2016.250",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1822--1826",
booktitle = "Proceedings - ECTC 2016",
address = "United States",
}