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Joint Properties and Thermomechanical Reliability of Nanoparticle-Added Sn-Ag-Cu Solder Paste
Kyoung Ho Kim, Sehoon Yoo, Jonghyuk Yoon, Songhee Yim, Bum Gyu Baek, Jong Hyun Yoon, Dohyun Jung, Jae Pil Jung
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
3
Scopus
citations