Joint Properties and Thermomechanical Reliability of Nanoparticle-Added Sn-Ag-Cu Solder Paste
- Kyoung Ho Kim
- , Sehoon Yoo
- , Jonghyuk Yoon
- , Songhee Yim
- , Bum Gyu Baek
- , Jong Hyun Yoon
- , Dohyun Jung
- , Jae Pil Jung
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
3
Scopus
citations