TY - GEN
T1 - Liquid phase diffusion bonding of Rene 80 superalloy using boron as an insert metal
AU - Jung, Jae Pil
AU - Kang, Choon Sik
AU - Lee, Young
PY - 1993
Y1 - 1993
N2 - The Transient Liquid Phase (TLP) bonding process is well known for bonding heat resistant superalloys, but it takes long time for bonding. To reduce bonding time of TLP process, we used highly diffusive element boron (B) as an insert metal, which is named as Melting Induced Diffusion (MID) bonding process. The MID process was applied to bond Rene80 Ni-base superalloy, and as results, bonding time including isothermal solidification and homogenization reduced to 1.3hr. And tensile strength at 871°C (1600°F) was 567MPa.
AB - The Transient Liquid Phase (TLP) bonding process is well known for bonding heat resistant superalloys, but it takes long time for bonding. To reduce bonding time of TLP process, we used highly diffusive element boron (B) as an insert metal, which is named as Melting Induced Diffusion (MID) bonding process. The MID process was applied to bond Rene80 Ni-base superalloy, and as results, bonding time including isothermal solidification and homogenization reduced to 1.3hr. And tensile strength at 871°C (1600°F) was 567MPa.
UR - http://www.scopus.com/inward/record.url?scp=0027850301&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:0027850301
SN - 0873392566
T3 - First International Conference on Processing Materials for Properties
SP - 23
EP - 27
BT - First International Conference on Processing Materials for Properties
PB - Publ by Minerals, Metals & Materials Soc (TMS)
T2 - Proceedings of the 1st International Conference on Processing Materials for Properties
Y2 - 7 November 1993 through 10 November 1993
ER -