Longitudinal ultrasonic bonding of electrodes between rigid and flexible printed circuit boards

Jong Bum Lee; Ja Myeong Koo; Soon Min Hong; Hyoyoung Shin; Young Jun Moon; Jae Pil Jung; Choong Don Yoo; Seung Boo Jung

doi:10.1143/JJAP.47.4300

Longitudinal ultrasonic bonding of electrodes between rigid and flexible printed circuit boards

Jong Bum Lee, Ja Myeong Koo, Soon Min Hong, Hyoyoung Shin, Young Jun Moon, Jae Pil Jung, Choong Don Yoo, Seung Boo Jung

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

In this study, two electrodes between a flexible printed circuit board (FPCB) and a rigid PCB (RPCB) are bonded using longitudinal ultrasonic vibration. The surface finish of the electrode of the RPCB is fixed as an electroless Ni/immersion Au (ENIG), whereas two different surface finishes are employed for the FPCB: immersion Sn and ENIG. Electrodes of the RPCB and FPCB are successfully bonded using longitudinal ultrasonic vibration. While a continuous intermetallic compound (IMC) of (Cu_xAu_1-x) ₆Sn₅ is formed at the ENIG/Sn interface, a Au-Ni-P reaction layer is formed with an un-bonded region at the ENIG/ENIG interface. The peel strength of the ENIG/Sn joint is higher than that of the ENIG/ENIG joint. Results of peel tests show that the bonding conditions have a significant eftect on joint integrity.

Original language	English
Pages (from-to)	4300-4304
Number of pages	5
Journal	Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume	47
Issue number	5 PART 2
DOIs	https://doi.org/10.1143/JJAP.47.4300
State	Published - 23 May 2008

Keywords

Electroless Ni/immersion Au (ENIG)
Flexible printed circuit board (FPCB)
Immersion Sn
Intermetallic compound (IMC)
Peel test
Rigid printed circuit board (RPCB)
Ultrasonic bonding

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10.1143/JJAP.47.4300

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@article{9a3d6adc10e74b54a2ce38d5fcd2132a,

title = "Longitudinal ultrasonic bonding of electrodes between rigid and flexible printed circuit boards",

abstract = "In this study, two electrodes between a flexible printed circuit board (FPCB) and a rigid PCB (RPCB) are bonded using longitudinal ultrasonic vibration. The surface finish of the electrode of the RPCB is fixed as an electroless Ni/immersion Au (ENIG), whereas two different surface finishes are employed for the FPCB: immersion Sn and ENIG. Electrodes of the RPCB and FPCB are successfully bonded using longitudinal ultrasonic vibration. While a continuous intermetallic compound (IMC) of (CuxAu1-x) 6Sn5 is formed at the ENIG/Sn interface, a Au-Ni-P reaction layer is formed with an un-bonded region at the ENIG/ENIG interface. The peel strength of the ENIG/Sn joint is higher than that of the ENIG/ENIG joint. Results of peel tests show that the bonding conditions have a significant eftect on joint integrity.",

keywords = "Electroless Ni/immersion Au (ENIG), Flexible printed circuit board (FPCB), Immersion Sn, Intermetallic compound (IMC), Peel test, Rigid printed circuit board (RPCB), Ultrasonic bonding",

author = "Lee, {Jong Bum} and Koo, {Ja Myeong} and Hong, {Soon Min} and Hyoyoung Shin and Moon, {Young Jun} and Jung, {Jae Pil} and Yoo, {Choong Don} and Jung, {Seung Boo}",

year = "2008",

month = may,

day = "23",

doi = "10.1143/JJAP.47.4300",

language = "English",

volume = "47",

pages = "4300--4304",

journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers",

issn = "0021-4922",

publisher = "Japan Society of Applied Physics",

number = "5 PART 2",

}

TY - JOUR

T1 - Longitudinal ultrasonic bonding of electrodes between rigid and flexible printed circuit boards

AU - Lee, Jong Bum

AU - Koo, Ja Myeong

AU - Hong, Soon Min

AU - Shin, Hyoyoung

AU - Moon, Young Jun

AU - Jung, Jae Pil

AU - Yoo, Choong Don

AU - Jung, Seung Boo

PY - 2008/5/23

Y1 - 2008/5/23

N2 - In this study, two electrodes between a flexible printed circuit board (FPCB) and a rigid PCB (RPCB) are bonded using longitudinal ultrasonic vibration. The surface finish of the electrode of the RPCB is fixed as an electroless Ni/immersion Au (ENIG), whereas two different surface finishes are employed for the FPCB: immersion Sn and ENIG. Electrodes of the RPCB and FPCB are successfully bonded using longitudinal ultrasonic vibration. While a continuous intermetallic compound (IMC) of (CuxAu1-x) 6Sn5 is formed at the ENIG/Sn interface, a Au-Ni-P reaction layer is formed with an un-bonded region at the ENIG/ENIG interface. The peel strength of the ENIG/Sn joint is higher than that of the ENIG/ENIG joint. Results of peel tests show that the bonding conditions have a significant eftect on joint integrity.

AB - In this study, two electrodes between a flexible printed circuit board (FPCB) and a rigid PCB (RPCB) are bonded using longitudinal ultrasonic vibration. The surface finish of the electrode of the RPCB is fixed as an electroless Ni/immersion Au (ENIG), whereas two different surface finishes are employed for the FPCB: immersion Sn and ENIG. Electrodes of the RPCB and FPCB are successfully bonded using longitudinal ultrasonic vibration. While a continuous intermetallic compound (IMC) of (CuxAu1-x) 6Sn5 is formed at the ENIG/Sn interface, a Au-Ni-P reaction layer is formed with an un-bonded region at the ENIG/ENIG interface. The peel strength of the ENIG/Sn joint is higher than that of the ENIG/ENIG joint. Results of peel tests show that the bonding conditions have a significant eftect on joint integrity.

KW - Electroless Ni/immersion Au (ENIG)

KW - Flexible printed circuit board (FPCB)

KW - Immersion Sn

KW - Intermetallic compound (IMC)

KW - Peel test

KW - Rigid printed circuit board (RPCB)

KW - Ultrasonic bonding

UR - http://www.scopus.com/inward/record.url?scp=54949126011&partnerID=8YFLogxK

U2 - 10.1143/JJAP.47.4300

DO - 10.1143/JJAP.47.4300

M3 - Article

AN - SCOPUS:54949126011

SN - 0021-4922

VL - 47

SP - 4300

EP - 4304

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

IS - 5 PART 2

ER -

Longitudinal ultrasonic bonding of electrodes between rigid and flexible printed circuit boards

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