Longitudinal ultrasonic bonding of electrodes between rigid and flexible printed circuit boards

Jong Bum Lee; Ja Myeong Koo; Soon Min Hong; Hyoyoung Shin; Young Jun Moon; Jae Pil Jung; Choong Don Yoo; Seung Boo Jung

doi:10.1143/JJAP.47.4300

Longitudinal ultrasonic bonding of electrodes between rigid and flexible printed circuit boards

Jong Bum Lee
, Ja Myeong Koo
, Soon Min Hong
, Hyoyoung Shin
, Young Jun Moon
, Jae Pil Jung
, Choong Don Yoo
, Seung Boo Jung

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

In this study, two electrodes between a flexible printed circuit board (FPCB) and a rigid PCB (RPCB) are bonded using longitudinal ultrasonic vibration. The surface finish of the electrode of the RPCB is fixed as an electroless Ni/immersion Au (ENIG), whereas two different surface finishes are employed for the FPCB: immersion Sn and ENIG. Electrodes of the RPCB and FPCB are successfully bonded using longitudinal ultrasonic vibration. While a continuous intermetallic compound (IMC) of (Cu_xAu_1-x) ₆Sn₅ is formed at the ENIG/Sn interface, a Au-Ni-P reaction layer is formed with an un-bonded region at the ENIG/ENIG interface. The peel strength of the ENIG/Sn joint is higher than that of the ENIG/ENIG joint. Results of peel tests show that the bonding conditions have a significant eftect on joint integrity.

Original language	English
Pages (from-to)	4300-4304
Number of pages	5
Journal	Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume	47
Issue number	5 PART 2
DOIs	https://doi.org/10.1143/JJAP.47.4300
State	Published - 23 May 2008

Keywords

Electroless Ni/immersion Au (ENIG)
Flexible printed circuit board (FPCB)
Immersion Sn
Intermetallic compound (IMC)
Peel test
Rigid printed circuit board (RPCB)
Ultrasonic bonding

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10.1143/JJAP.47.4300

Cite this

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title = "Longitudinal ultrasonic bonding of electrodes between rigid and flexible printed circuit boards",

abstract = "In this study, two electrodes between a flexible printed circuit board (FPCB) and a rigid PCB (RPCB) are bonded using longitudinal ultrasonic vibration. The surface finish of the electrode of the RPCB is fixed as an electroless Ni/immersion Au (ENIG), whereas two different surface finishes are employed for the FPCB: immersion Sn and ENIG. Electrodes of the RPCB and FPCB are successfully bonded using longitudinal ultrasonic vibration. While a continuous intermetallic compound (IMC) of (CuxAu1-x) 6Sn5 is formed at the ENIG/Sn interface, a Au-Ni-P reaction layer is formed with an un-bonded region at the ENIG/ENIG interface. The peel strength of the ENIG/Sn joint is higher than that of the ENIG/ENIG joint. Results of peel tests show that the bonding conditions have a significant eftect on joint integrity.",

keywords = "Electroless Ni/immersion Au (ENIG), Flexible printed circuit board (FPCB), Immersion Sn, Intermetallic compound (IMC), Peel test, Rigid printed circuit board (RPCB), Ultrasonic bonding",

author = "Lee, \{Jong Bum\} and Koo, \{Ja Myeong\} and Hong, \{Soon Min\} and Hyoyoung Shin and Moon, \{Young Jun\} and Jung, \{Jae Pil\} and Yoo, \{Choong Don\} and Jung, \{Seung Boo\}",

year = "2008",

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doi = "10.1143/JJAP.47.4300",

language = "English",

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AU - Lee, Jong Bum

AU - Koo, Ja Myeong

AU - Hong, Soon Min

AU - Shin, Hyoyoung

AU - Moon, Young Jun

AU - Jung, Jae Pil

AU - Yoo, Choong Don

AU - Jung, Seung Boo

PY - 2008/5/23

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N2 - In this study, two electrodes between a flexible printed circuit board (FPCB) and a rigid PCB (RPCB) are bonded using longitudinal ultrasonic vibration. The surface finish of the electrode of the RPCB is fixed as an electroless Ni/immersion Au (ENIG), whereas two different surface finishes are employed for the FPCB: immersion Sn and ENIG. Electrodes of the RPCB and FPCB are successfully bonded using longitudinal ultrasonic vibration. While a continuous intermetallic compound (IMC) of (CuxAu1-x) 6Sn5 is formed at the ENIG/Sn interface, a Au-Ni-P reaction layer is formed with an un-bonded region at the ENIG/ENIG interface. The peel strength of the ENIG/Sn joint is higher than that of the ENIG/ENIG joint. Results of peel tests show that the bonding conditions have a significant eftect on joint integrity.

AB - In this study, two electrodes between a flexible printed circuit board (FPCB) and a rigid PCB (RPCB) are bonded using longitudinal ultrasonic vibration. The surface finish of the electrode of the RPCB is fixed as an electroless Ni/immersion Au (ENIG), whereas two different surface finishes are employed for the FPCB: immersion Sn and ENIG. Electrodes of the RPCB and FPCB are successfully bonded using longitudinal ultrasonic vibration. While a continuous intermetallic compound (IMC) of (CuxAu1-x) 6Sn5 is formed at the ENIG/Sn interface, a Au-Ni-P reaction layer is formed with an un-bonded region at the ENIG/ENIG interface. The peel strength of the ENIG/Sn joint is higher than that of the ENIG/ENIG joint. Results of peel tests show that the bonding conditions have a significant eftect on joint integrity.

KW - Electroless Ni/immersion Au (ENIG)

KW - Flexible printed circuit board (FPCB)

KW - Immersion Sn

KW - Intermetallic compound (IMC)

KW - Peel test

KW - Rigid printed circuit board (RPCB)

KW - Ultrasonic bonding

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DO - 10.1143/JJAP.47.4300

M3 - Article

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JO - Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

IS - 5 PART 2

ER -

Longitudinal ultrasonic bonding of electrodes between rigid and flexible printed circuit boards

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