Machine Learning-Based Solution for Thermomechanical Analysis of MMIC Packaging
- Sumin Kang
- , Jae Hak Lee
- , Seung Man Kim
- , Jaeseung Lim
- , Ah Young Park
- , Seongheum Han
- , Jun Yeob Song
- , Seong Il Kim
- Korea Institute of Machinery and Materials
- Chonnam National University
- Electronics and Telecommunications Research Institute
Research output: Contribution to journal › Article › peer-review
7
Scopus
citations