TY - GEN
T1 - Microstructure and Mechanical Properties of Type 8 Solder Paste for Mini-LED Assembly Using Laser-Assisted Bonding
AU - Ku, Jun Ho
AU - Rajendran, Sri Harini
AU - Jung, Jae Pil
N1 - Publisher Copyright:
© 2024 Japan Institute of Electronics Packaging.
PY - 2024
Y1 - 2024
N2 - In response to the ongoing miniaturization and high-density requirements of the latest electronics industry, the size of semiconductor components is significantly decreasing. As the current semiconductor front-end processes have reached their limits in miniaturization, there is a need for further miniaturization in the back-end processes. In the back-end processes, solder, primarily used to connect chips and PCBs, is also undergoing miniaturization, with solder in paste form gaining attention. In this paper, 8-type solder paste with a powder size of 2-8μm was applied to a PCB using stencil printing, followed by the mounting of mini-LEDs and bonding using laser-assisted bonding. Subsequently, aging experiments were conducted to evaluate high-temperature reliability. Scanning Electron Microscopy (SEM) and Energy Dispersive X-ray Spectroscopy (EDS) were employed for microstructure analysis, and shear tests were conducted to assess shear strength and solder adhesion.
AB - In response to the ongoing miniaturization and high-density requirements of the latest electronics industry, the size of semiconductor components is significantly decreasing. As the current semiconductor front-end processes have reached their limits in miniaturization, there is a need for further miniaturization in the back-end processes. In the back-end processes, solder, primarily used to connect chips and PCBs, is also undergoing miniaturization, with solder in paste form gaining attention. In this paper, 8-type solder paste with a powder size of 2-8μm was applied to a PCB using stencil printing, followed by the mounting of mini-LEDs and bonding using laser-assisted bonding. Subsequently, aging experiments were conducted to evaluate high-temperature reliability. Scanning Electron Microscopy (SEM) and Energy Dispersive X-ray Spectroscopy (EDS) were employed for microstructure analysis, and shear tests were conducted to assess shear strength and solder adhesion.
KW - Intermetallic compounds (IMCs)
KW - Laser-assisted bonding
KW - Mini LED
KW - Shear strength
KW - Sn3.0Ag0.5Cu (SAC305)
UR - http://www.scopus.com/inward/record.url?scp=85195506971&partnerID=8YFLogxK
U2 - 10.23919/ICEP61562.2024.10535592
DO - 10.23919/ICEP61562.2024.10535592
M3 - Conference contribution
AN - SCOPUS:85195506971
T3 - 2024 International Conference on Electronics Packaging, ICEP 2024
SP - 309
EP - 310
BT - 2024 International Conference on Electronics Packaging, ICEP 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 23rd International Conference on Electronics Packaging, ICEP 2024
Y2 - 17 April 2024 through 20 April 2024
ER -