Microstructure evolution of the Ir-inserted Ni suicides with additional annealing

Engineering

• Surface 100%
• Annealing 100%
• Roughness 60%
• Temperature 60%
• Thickness 60%
• Polysilicon 60%
• Sheet Resistance 40%
• Rapid Thermal Annealing 40%
• Transmissions 20%
• Determines 20%
• Significant Increase 20%
• Probe Point 20%
• Ray Diffraction 20%
• High Resolution 20%
• Chemical Composition 20%
• Cross Section 20%
• Low Resistance 20%
• Mixing 20%

Material Science

• Microstructure 100%
• Silicide 100%
• Silicon 100%
• Annealing 100%
• Temperature 66%
• Surface Roughness 50%
• Single Crystal 50%
• Surface 33%
• Probe 33%
• Nickel 33%
• Thermal Stability 16%

Chemical Engineering

• Temperature 66%
• Polysilicon 66%
• Silicon 50%
• Nickel 33%
• Agglomeration 33%
• Sheet Resistance 33%