Nonlinear vibration analysis of ultrasonic horn model for flip-chip bonding

Soo Il Lee, Sang Hyuk Hong

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

A simple model has been developed and analyzed capturing the main dynamic features in longitudinal flip-chip bonding. The ultrasonic horn is modeled as a longitudinal rod with the contact conditions after verifying the modal characteristics by using finite element analysis. The MATLAB simulation is performed for the simplified equation of motion of the horn model and the results show the nonlinear vibration effects in the flip-chip bonding process.

Original languageEnglish
Title of host publicationICCAS 2007 - International Conference on Control, Automation and Systems
Pages2804-2807
Number of pages4
DOIs
StatePublished - 2007
EventInternational Conference on Control, Automation and Systems, ICCAS 2007 - Seoul, Korea, Republic of
Duration: 17 Oct 200720 Oct 2007

Publication series

NameICCAS 2007 - International Conference on Control, Automation and Systems

Conference

ConferenceInternational Conference on Control, Automation and Systems, ICCAS 2007
Country/TerritoryKorea, Republic of
CitySeoul
Period17/10/0720/10/07

Keywords

  • Flip-chip bonding
  • Nonlinear analysis
  • Ultrasonic horn

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