O ₂ plasma oxidation of sputter-deposited Cu thin film during photo resist ashing

Material Science

• Thin Films 100%
• Oxide Compound 100%
• Oxidation Reaction 100%
• Copper 80%
• Temperature 60%
• Film 20%
• Scanning Electron Microscopy 20%
• Topography 20%
• X-Ray Diffraction 20%
• Transmission Electron Microscopy 20%
• Auger Electron Spectroscopy 20%

Engineering

• Thin Films 100%
• Oxide Layer 100%
• Plasma Treatment 66%
• Substrates 33%
• Room Temperature 33%
• Transmissions 33%
• High Temperature 33%
• Low-Temperature 33%
• Ray Diffraction 33%
• Radio Frequency 33%

Physics

• Oxide 100%
• Oxidation 100%
• Room Temperature 16%
• Transmission Electron Microscopy 16%
• Electron 16%
• X Ray Diffraction 16%
• Scanning Electron Microscopy 16%
• Pressure 16%
• Substrates 16%
• Temperature 16%
• Diameters 16%
• Oxygen 16%