Pb-free solder bumping for flip chip package by electroplating

Hyeon Hwang; Soon Min Hong; Jae Pil Jung; Choon Sik Kang

doi:10.1108/09540910310479486

Pb-free solder bumping for flip chip package by electroplating

Hyeon Hwang, Soon Min Hong, Jae Pil Jung, Choon Sik Kang

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

16 Scopus citations

Abstract

Sn-Pb and Sn-Ag bumps (130 μm diameter, 250 μm pitch) made using an electroplating process were studied. As a preliminary experiment, the effects of current density and plating time on the Sn-Pb and Sn-Ag deposits were investigated. The morphology and composition of the plated surface were examined using scanning electron microscopy. The shape and thickness of the solder bumps were also compared. Bump shear testing was performed to measure the adhesion strength between the solder bumps and the under bump metallurgy. In electroplating, the Sn-Ag plating thickness was proportional to the current density, while plated Sn-Pb thickness saturated above the limiting current density. The optimal conditions for solder bump fabrication were found at 6 A/dm²².

Original language	English
Pages (from-to)	10-16
Number of pages	7
Journal	Soldering and Surface Mount Technology
Volume	15
Issue number	2
DOIs	https://doi.org/10.1108/09540910310479486
State	Published - 1 Aug 2003

Keywords

Electroplating
Flip chip
Lead-free soldering

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10.1108/09540910310479486

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abstract = "Sn-Pb and Sn-Ag bumps (130 μm diameter, 250 μm pitch) made using an electroplating process were studied. As a preliminary experiment, the effects of current density and plating time on the Sn-Pb and Sn-Ag deposits were investigated. The morphology and composition of the plated surface were examined using scanning electron microscopy. The shape and thickness of the solder bumps were also compared. Bump shear testing was performed to measure the adhesion strength between the solder bumps and the under bump metallurgy. In electroplating, the Sn-Ag plating thickness was proportional to the current density, while plated Sn-Pb thickness saturated above the limiting current density. The optimal conditions for solder bump fabrication were found at 6 A/dm22.",

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AU - Hwang, Hyeon

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AU - Jung, Jae Pil

AU - Kang, Choon Sik

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Y1 - 2003/8/1

N2 - Sn-Pb and Sn-Ag bumps (130 μm diameter, 250 μm pitch) made using an electroplating process were studied. As a preliminary experiment, the effects of current density and plating time on the Sn-Pb and Sn-Ag deposits were investigated. The morphology and composition of the plated surface were examined using scanning electron microscopy. The shape and thickness of the solder bumps were also compared. Bump shear testing was performed to measure the adhesion strength between the solder bumps and the under bump metallurgy. In electroplating, the Sn-Ag plating thickness was proportional to the current density, while plated Sn-Pb thickness saturated above the limiting current density. The optimal conditions for solder bump fabrication were found at 6 A/dm22.

AB - Sn-Pb and Sn-Ag bumps (130 μm diameter, 250 μm pitch) made using an electroplating process were studied. As a preliminary experiment, the effects of current density and plating time on the Sn-Pb and Sn-Ag deposits were investigated. The morphology and composition of the plated surface were examined using scanning electron microscopy. The shape and thickness of the solder bumps were also compared. Bump shear testing was performed to measure the adhesion strength between the solder bumps and the under bump metallurgy. In electroplating, the Sn-Ag plating thickness was proportional to the current density, while plated Sn-Pb thickness saturated above the limiting current density. The optimal conditions for solder bump fabrication were found at 6 A/dm22.

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Pb-free solder bumping for flip chip package by electroplating

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Keywords

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