Phonon-Assisted Charge Trapping and Threshold Voltage Modulation in MoS2FETs with AlOxNyOverlayers

Research output: Contribution to journalArticlepeer-review

Abstract

In this study, we demonstrate that a room-temperature reactively sputtered aluminum oxynitride (AlOxNy) overlayer enables both effective doping and pronounced threshold voltage hysteresis in multilayer MoS2FETs, while preserving field-effect mobility. Compared to conventional AlOx, the AlOxNylayer introduces trap states that are energetically aligned with the conduction band of MoS2, facilitating charge exchange across the heterointerface. Capacitance–voltage measurements confirm that nitrogen incorporation reduces the effective fixed charge density, enabling mobility-preserving operation without thermal annealing. Notably, the hysteresis window exhibits a marked expansion above ∼250 K, which correlates with the activation of out-of-plane phonon modes in MoS2. These phonons are proposed to assist in activating interfacial trap states within the AlOxNylayer, as supported by temperature-dependent electrical and spectroscopic analyses. While such trap-induced hysteresis may be undesirable for logic circuits, it offers valuable functionality for emerging device architectures─such as in-memory computing and neuromorphic systems─where hysteresis can be exploited. These findings underscore the potential of AlOxNyas a low-temperature-processable dielectric for 2D FETs and advance a new perspective on phonon-assisted interfacial charge modulation.

Original languageEnglish
Pages (from-to)48592-48599
Number of pages8
JournalACS Applied Materials and Interfaces
Volume17
Issue number34
DOIs
StatePublished - 27 Aug 2025

Keywords

  • doping
  • hysteresis
  • interfacial interaction
  • MoS
  • neuromorphic computing
  • phonon
  • temperature dependence
  • trap states

Fingerprint

Dive into the research topics of 'Phonon-Assisted Charge Trapping and Threshold Voltage Modulation in MoS2FETs with AlOxNyOverlayers'. Together they form a unique fingerprint.

Cite this