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Prediction of deformation during manufacturing processes of silicon interposer package with TSVs

  • Yeonsung Kim
  • , Ah Young Park
  • , Chin Li Kao
  • , Michael Su
  • , Bryan Black
  • , Seungbae Park
  • State University of New York Binghamton University
  • Advanced Semiconductor Engineering, Inc.
  • Advanced Micro Devices

Research output: Contribution to journal › Article › peer-review

35 Scopus citations

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