Prediction of thermal fatigue life of lead-free BGA solder joints by finite element analysis

Y. E. Shin; K. W. Lee; K. H. Chang; S. B. Jung; J. P. Jung

doi:10.2320/matertrans.42.809

Prediction of thermal fatigue life of lead-free BGA solder joints by finite element analysis

Y. E. Shin, K. W. Lee, K. H. Chang, S. B. Jung, J. P. Jung

Department of Materials Science and Engineering

Chung-Ang University

Research output: Contribution to journal › Article › peer-review

10 Scopus citations

Abstract

This study was focused on the numerical prediction of the thermal fatigue life of a μBGA (Micro Ball Grid Array) solder joint. Numerical method was performed to predict three-dimensional finite element analysis with various solder alloys such as Sn-37 mass%Pb, Sn-3.5 mass%Ag, Sn-3.5 mass%Ag-0.7 mass%Cu and Sn-3.5 mass%Ag-3 mass%ln-0.5 mass%Bi during a given thermal cycling. Strain values, which were obtained by the result of mechanical fatigue tests for solder alloys, were used to predict the solder joint fatigue life using the Coffin-Manson equation. The numerical results showed that Sn-3.5 mass%Ag with the 50 degree ball shape geometry had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable γ.

Original language	English
Pages (from-to)	809-813
Number of pages	5
Journal	Materials Transactions
Volume	42
Issue number	5
DOIs	https://doi.org/10.2320/matertrans.42.809
State	Published - 2001

Keywords

Finite element method
Lead-free solder
Micro ball grid array
Solder joint
Thermal fatigue life

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10.2320/matertrans.42.809

Cite this

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title = "Prediction of thermal fatigue life of lead-free BGA solder joints by finite element analysis",

abstract = "This study was focused on the numerical prediction of the thermal fatigue life of a μBGA (Micro Ball Grid Array) solder joint. Numerical method was performed to predict three-dimensional finite element analysis with various solder alloys such as Sn-37 mass%Pb, Sn-3.5 mass%Ag, Sn-3.5 mass%Ag-0.7 mass%Cu and Sn-3.5 mass%Ag-3 mass%ln-0.5 mass%Bi during a given thermal cycling. Strain values, which were obtained by the result of mechanical fatigue tests for solder alloys, were used to predict the solder joint fatigue life using the Coffin-Manson equation. The numerical results showed that Sn-3.5 mass%Ag with the 50 degree ball shape geometry had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable γ.",

keywords = "Finite element method, Lead-free solder, Micro ball grid array, Solder joint, Thermal fatigue life",

author = "Shin, {Y. E.} and Lee, {K. W.} and Chang, {K. H.} and Jung, {S. B.} and Jung, {J. P.}",

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AU - Lee, K. W.

AU - Chang, K. H.

AU - Jung, S. B.

AU - Jung, J. P.

PY - 2001

Y1 - 2001

N2 - This study was focused on the numerical prediction of the thermal fatigue life of a μBGA (Micro Ball Grid Array) solder joint. Numerical method was performed to predict three-dimensional finite element analysis with various solder alloys such as Sn-37 mass%Pb, Sn-3.5 mass%Ag, Sn-3.5 mass%Ag-0.7 mass%Cu and Sn-3.5 mass%Ag-3 mass%ln-0.5 mass%Bi during a given thermal cycling. Strain values, which were obtained by the result of mechanical fatigue tests for solder alloys, were used to predict the solder joint fatigue life using the Coffin-Manson equation. The numerical results showed that Sn-3.5 mass%Ag with the 50 degree ball shape geometry had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable γ.

AB - This study was focused on the numerical prediction of the thermal fatigue life of a μBGA (Micro Ball Grid Array) solder joint. Numerical method was performed to predict three-dimensional finite element analysis with various solder alloys such as Sn-37 mass%Pb, Sn-3.5 mass%Ag, Sn-3.5 mass%Ag-0.7 mass%Cu and Sn-3.5 mass%Ag-3 mass%ln-0.5 mass%Bi during a given thermal cycling. Strain values, which were obtained by the result of mechanical fatigue tests for solder alloys, were used to predict the solder joint fatigue life using the Coffin-Manson equation. The numerical results showed that Sn-3.5 mass%Ag with the 50 degree ball shape geometry had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable γ.

KW - Finite element method

KW - Lead-free solder

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KW - Thermal fatigue life

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Prediction of thermal fatigue life of lead-free BGA solder joints by finite element analysis

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Keywords

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