Prediction of thermal fatigue life of lead-free BGA solder joints by finite element analysis

Y. E. Shin, K. W. Lee, K. H. Chang, S. B. Jung, J. P. Jung

Research output: Contribution to journalArticlepeer-review

10 Scopus citations

Abstract

This study was focused on the numerical prediction of the thermal fatigue life of a μBGA (Micro Ball Grid Array) solder joint. Numerical method was performed to predict three-dimensional finite element analysis with various solder alloys such as Sn-37 mass%Pb, Sn-3.5 mass%Ag, Sn-3.5 mass%Ag-0.7 mass%Cu and Sn-3.5 mass%Ag-3 mass%ln-0.5 mass%Bi during a given thermal cycling. Strain values, which were obtained by the result of mechanical fatigue tests for solder alloys, were used to predict the solder joint fatigue life using the Coffin-Manson equation. The numerical results showed that Sn-3.5 mass%Ag with the 50 degree ball shape geometry had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable γ.

Original languageEnglish
Pages (from-to)809-813
Number of pages5
JournalMaterials Transactions
Volume42
Issue number5
DOIs
StatePublished - 2001

Keywords

  • Finite element method
  • Lead-free solder
  • Micro ball grid array
  • Solder joint
  • Thermal fatigue life

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