Recent Advances in Active Metal Brazing of Ceramics and Process

S. Mishra, A. Sharma, D. H. Jung, J. P. Jung

Research output: Contribution to journalReview articlepeer-review

43 Scopus citations

Abstract

Abstract: Ceramic to metal joining has its potential applications in microelectronics packaging, metal–ceramic seals, vacuum tubes, sapphire metal windows, etc. But there are many limitations in joining this duo of materials that range from their structures, nature of bonding, physical properties to a complex phenomenon like wetting, spreading and adhesion. The current review discusses these critical issues from the aspects of thermodynamics, the role, and type of active elements, Ag–Cu–Ti brazing filler system and the reliability factors like residual stress, coefficient of thermal expansion, material reliability, pores and unbonded regions on the surface which affect the mechanical reliability of the joint. Graphic Abstract: [Figure not available: see fulltext.]

Original languageEnglish
Pages (from-to)1087-1098
Number of pages12
JournalMetals and Materials International
Volume26
Issue number8
DOIs
StatePublished - 1 Aug 2020

Keywords

  • Active metal brazing
  • Ceramic
  • Metal
  • Reliability
  • Wetting

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