Recent progress in transient liquid phase and wire bonding technologies for power electronics

Hyejun Kang, Ashutosh Sharma, Jae Pil Jung

Research output: Contribution to journalReview articlepeer-review

29 Scopus citations

Abstract

Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials during low-temperature sintering. Moreover, the transient TLP bonding occurs at a lower temperature, is cost-effective, and causes less joint porosity. Wire bonding is also a common process to interconnect between the power module package to direct bonded copper (DBC). In this context, we propose to review the challenges and advances in TLP and ultrasonic wire bonding technology using Sn-based solders for power electronics packaging.

Original languageEnglish
Article number934
Pages (from-to)1-21
Number of pages21
JournalMetals
Volume10
Issue number7
DOIs
StatePublished - 2020

Keywords

  • Brazing
  • Die-attached materials
  • Power module
  • TLP bonding
  • Wire bonding

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