Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead frames

Se Ho Kee; Won Joong Kim; Jae Pil Jung

doi:10.1016/j.surfcoat.2013.09.002

Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead frames

Se Ho Kee, Won Joong Kim, Jae Pil Jung

Department of Materials Science and Engineering

University of Seoul

Research output: Contribution to journal › Article › peer-review

10 Scopus citations

Abstract

The characteristics and reflection properties of a Sn-3.5. wt.%Ag (hereafter, Sn-3.5Ag) thin film on a light emitting diode (LED) lead frame were investigated in this study. The advantages of a Sn-3.5Ag layer, namely its good solderability and low cost compared to Ag, are attractive for LED applications. A Sn-3.5Ag layer was deposited in an electroless process on an electro-plated copper substrate with bath immersion times of 2 to 10. min. At an immersion time of 4. min, the optical density and reflectivity of the Sn-3.5Ag deposits was 1.91. D and approximately 98%, respectively. The reflectivity of the Sn-3.5Ag deposition layer decreased with increasing surface roughness and with larger grain size. The reflectivity of a sample aged for 100. days decreased approximately 3.6% compared to the as-plated Sn-3.5Ag sample.

Original language	English
Pages (from-to)	778-783
Number of pages	6
Journal	Surface and Coatings Technology
Volume	235
DOIs	https://doi.org/10.1016/j.surfcoat.2013.09.002
State	Published - 25 Nov 2013

Keywords

Lead frame
Light emitting diode
Reflectivity
Sn-3.5Ag electroless deposition

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10.1016/j.surfcoat.2013.09.002

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title = "Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead frames",

abstract = "The characteristics and reflection properties of a Sn-3.5. wt.%Ag (hereafter, Sn-3.5Ag) thin film on a light emitting diode (LED) lead frame were investigated in this study. The advantages of a Sn-3.5Ag layer, namely its good solderability and low cost compared to Ag, are attractive for LED applications. A Sn-3.5Ag layer was deposited in an electroless process on an electro-plated copper substrate with bath immersion times of 2 to 10. min. At an immersion time of 4. min, the optical density and reflectivity of the Sn-3.5Ag deposits was 1.91. D and approximately 98%, respectively. The reflectivity of the Sn-3.5Ag deposition layer decreased with increasing surface roughness and with larger grain size. The reflectivity of a sample aged for 100. days decreased approximately 3.6% compared to the as-plated Sn-3.5Ag sample.",

keywords = "Lead frame, Light emitting diode, Reflectivity, Sn-3.5Ag electroless deposition",

author = "Kee, {Se Ho} and Kim, {Won Joong} and Jung, {Jae Pil}",

year = "2013",

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doi = "10.1016/j.surfcoat.2013.09.002",

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journal = "Surface and Coatings Technology",

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TY - JOUR

T1 - Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead frames

AU - Kee, Se Ho

AU - Kim, Won Joong

AU - Jung, Jae Pil

PY - 2013/11/25

Y1 - 2013/11/25

N2 - The characteristics and reflection properties of a Sn-3.5. wt.%Ag (hereafter, Sn-3.5Ag) thin film on a light emitting diode (LED) lead frame were investigated in this study. The advantages of a Sn-3.5Ag layer, namely its good solderability and low cost compared to Ag, are attractive for LED applications. A Sn-3.5Ag layer was deposited in an electroless process on an electro-plated copper substrate with bath immersion times of 2 to 10. min. At an immersion time of 4. min, the optical density and reflectivity of the Sn-3.5Ag deposits was 1.91. D and approximately 98%, respectively. The reflectivity of the Sn-3.5Ag deposition layer decreased with increasing surface roughness and with larger grain size. The reflectivity of a sample aged for 100. days decreased approximately 3.6% compared to the as-plated Sn-3.5Ag sample.

AB - The characteristics and reflection properties of a Sn-3.5. wt.%Ag (hereafter, Sn-3.5Ag) thin film on a light emitting diode (LED) lead frame were investigated in this study. The advantages of a Sn-3.5Ag layer, namely its good solderability and low cost compared to Ag, are attractive for LED applications. A Sn-3.5Ag layer was deposited in an electroless process on an electro-plated copper substrate with bath immersion times of 2 to 10. min. At an immersion time of 4. min, the optical density and reflectivity of the Sn-3.5Ag deposits was 1.91. D and approximately 98%, respectively. The reflectivity of the Sn-3.5Ag deposition layer decreased with increasing surface roughness and with larger grain size. The reflectivity of a sample aged for 100. days decreased approximately 3.6% compared to the as-plated Sn-3.5Ag sample.

KW - Lead frame

KW - Light emitting diode

KW - Reflectivity

KW - Sn-3.5Ag electroless deposition

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U2 - 10.1016/j.surfcoat.2013.09.002

DO - 10.1016/j.surfcoat.2013.09.002

M3 - Article

AN - SCOPUS:84886296231

SN - 0257-8972

VL - 235

SP - 778

EP - 783

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

ER -

Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead frames

Abstract

Keywords

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