Reflectivity and thermal shock properties of Sn-3.5Ag electroless-plated deposit for LED Lead frames

Se Ho Kee; Won Joong Kim; Jae Pil Jung

doi:10.3365/KJMM.2013.51.2.089

Reflectivity and thermal shock properties of Sn-3.5Ag electroless-plated deposit for LED Lead frames

Se Ho Kee, Won Joong Kim, Jae Pil Jung

Department of Materials Science and Engineering

University of Seoul

Research output: Contribution to journal › Article › peer-review

Abstract

The surface roughness and reflection characteristics of electroless-plated Sn-3.5 wt%Ag on a LED (light emitting diode) lead frame were investigated. Cu electroplating was carried out prior to electroless plating of Sn-3.5Ag to improve the reflectivity of the Sn-3.5Ag deposit. A thermal shock test was performed to evaluate the stability of the deposits, namely the surface roughness and the reflectivity of the Sn-3.5Ag layer. The experimental results revealed that the surface roughness of the Sn-3.5Ag deposit was 0.135pm (arithmetical average roughness, R_a), 1.77 um (maximum height roughness, R_max) and the reflectivity was 1.86 GAM. After 500 thermal shock cycles of the Sn-3.5Ag deposit between 85°C and -55°C, the surface roughness became 0.145 μm (R_a) and 1.93 μm (R _max), and the reflectivity was 1.76 GAM, which indicates that the Sn-3.5Ag deposit was stabilized by 500 thermal cycles.

Original language	English
Pages (from-to)	89-94
Number of pages	6
Journal	Journal of Korean Institute of Metals and Materials
Volume	51
Issue number	2
DOIs	https://doi.org/10.3365/KJMM.2013.51.2.089
State	Published - Feb 2013

Keywords

Alloys
Plating
Reflectivity
Surface
Thermal analysis

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10.3365/KJMM.2013.51.2.089

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title = "Reflectivity and thermal shock properties of Sn-3.5Ag electroless-plated deposit for LED Lead frames",

abstract = "The surface roughness and reflection characteristics of electroless-plated Sn-3.5 wt%Ag on a LED (light emitting diode) lead frame were investigated. Cu electroplating was carried out prior to electroless plating of Sn-3.5Ag to improve the reflectivity of the Sn-3.5Ag deposit. A thermal shock test was performed to evaluate the stability of the deposits, namely the surface roughness and the reflectivity of the Sn-3.5Ag layer. The experimental results revealed that the surface roughness of the Sn-3.5Ag deposit was 0.135pm (arithmetical average roughness, Ra), 1.77 um (maximum height roughness, Rmax) and the reflectivity was 1.86 GAM. After 500 thermal shock cycles of the Sn-3.5Ag deposit between 85°C and -55°C, the surface roughness became 0.145 μm (Ra) and 1.93 μm (R max), and the reflectivity was 1.76 GAM, which indicates that the Sn-3.5Ag deposit was stabilized by 500 thermal cycles.",

keywords = "Alloys, Plating, Reflectivity, Surface, Thermal analysis",

author = "Kee, {Se Ho} and Kim, {Won Joong} and Jung, {Jae Pil}",

year = "2013",

month = feb,

doi = "10.3365/KJMM.2013.51.2.089",

language = "English",

volume = "51",

pages = "89--94",

journal = "Journal of Korean Institute of Metals and Materials",

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publisher = "Korean Institute of Metals and Materials",

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T1 - Reflectivity and thermal shock properties of Sn-3.5Ag electroless-plated deposit for LED Lead frames

AU - Kee, Se Ho

AU - Kim, Won Joong

AU - Jung, Jae Pil

PY - 2013/2

Y1 - 2013/2

N2 - The surface roughness and reflection characteristics of electroless-plated Sn-3.5 wt%Ag on a LED (light emitting diode) lead frame were investigated. Cu electroplating was carried out prior to electroless plating of Sn-3.5Ag to improve the reflectivity of the Sn-3.5Ag deposit. A thermal shock test was performed to evaluate the stability of the deposits, namely the surface roughness and the reflectivity of the Sn-3.5Ag layer. The experimental results revealed that the surface roughness of the Sn-3.5Ag deposit was 0.135pm (arithmetical average roughness, Ra), 1.77 um (maximum height roughness, Rmax) and the reflectivity was 1.86 GAM. After 500 thermal shock cycles of the Sn-3.5Ag deposit between 85°C and -55°C, the surface roughness became 0.145 μm (Ra) and 1.93 μm (R max), and the reflectivity was 1.76 GAM, which indicates that the Sn-3.5Ag deposit was stabilized by 500 thermal cycles.

AB - The surface roughness and reflection characteristics of electroless-plated Sn-3.5 wt%Ag on a LED (light emitting diode) lead frame were investigated. Cu electroplating was carried out prior to electroless plating of Sn-3.5Ag to improve the reflectivity of the Sn-3.5Ag deposit. A thermal shock test was performed to evaluate the stability of the deposits, namely the surface roughness and the reflectivity of the Sn-3.5Ag layer. The experimental results revealed that the surface roughness of the Sn-3.5Ag deposit was 0.135pm (arithmetical average roughness, Ra), 1.77 um (maximum height roughness, Rmax) and the reflectivity was 1.86 GAM. After 500 thermal shock cycles of the Sn-3.5Ag deposit between 85°C and -55°C, the surface roughness became 0.145 μm (Ra) and 1.93 μm (R max), and the reflectivity was 1.76 GAM, which indicates that the Sn-3.5Ag deposit was stabilized by 500 thermal cycles.

KW - Alloys

KW - Plating

KW - Reflectivity

KW - Surface

KW - Thermal analysis

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VL - 51

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JO - Journal of Korean Institute of Metals and Materials

JF - Journal of Korean Institute of Metals and Materials

IS - 2

ER -

Reflectivity and thermal shock properties of Sn-3.5Ag electroless-plated deposit for LED Lead frames

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