@inproceedings{d95595337a5f43598fc182d91984882b,
title = "Reproducing the Shilla Dynasty's direct-bonding granulation process",
abstract = "Granulation is a precious metal craft process method that decorates a metal surface using tiny metal granules. It was imported into Korea during the Shilla Dynasty around 1500 years ago, and many granulation ornaments have been found with the process's unique bonding features. The granules show a direct bonded interface with a neck. The key technology of making granules and bonding the granules is not well known. Thus, it is a technology of the Lost World. Although the exact bonding method is unidentifiable, it is known that the traditional method of preparing gold granules was time consuming and costly. Therefore, we proposed a process to reproduce the Shilla's granulation ornament using a modern method. First, we employed atomization to produce 22K gold granules. Direct bonding was accomplished using a spot welder and vacuum jig instead of using the traditional method of graphite bed melting and direct annealing. 0.8 mm granules were successfully fabricated and bonded directly to the substrate with a necking and 35% bonding ratio, which is very similar to Shilla's granule bonding. Moreover, to estimate the bond strength, K factors (fracture toughness index) at different bonding ratios were evaluated using a finite element method simulation. Our proposed direct bonded granule process and design were expected to have enough bond strength to be used as a key element for fine modern jewelry.",
keywords = "Direct bonding, Filigree, Gold granule, Granulation, Spot welding",
author = "Ohsung Song and Jongryul Kim and Myungro Kim",
year = "2008",
doi = "10.4028/www.scientific.net/msf.580-582.183",
language = "English",
series = "Materials Science Forum",
publisher = "Trans Tech Publications Ltd.",
pages = "183--190",
editor = "Lee, {Chang Hee} and Jong-Bong Lee and Jong-Bong Lee and Dong-Hwan Park and Suck-Joo Na",
booktitle = "Materials Science Forum - Advanced Welding and Micro Joining/Packaging for the 21st Century - Selected peer reviewed papers from the International Welding/Joining Conference-Korea 2007, IWJC 2007",
address = "Switzerland",
note = "International Welding/Joining Conference-Korea 2007, IWJC 2007 ; Conference date: 10-05-2007 Through 12-05-2007",
}