Shear strength and interfacial compound of Sn-Ag-Bi-In alloy

Moon Il Kim; Joon Kwon Moon; Jae Pil Jung

doi:10.2320/matertrans.43.1791

Shear strength and interfacial compound of Sn-Ag-Bi-In alloy

Moon Il Kim, Joon Kwon Moon, Jae Pil Jung

Department of Materials Science and Engineering

University of Seoul

Research output: Contribution to journal › Article › peer-review

10 Scopus citations

Abstract

Sn-3Ag-8Bi-5In solder (melting point, 461-477 K) was investigated as a lead(Pb)-free solder. In order to evaluate the solderability of the Sn-Ag-Bi-In alloy, the shear strength of soldered joint and inter-metallic compound (IMC) were investigated. As an experimental procedure, a 0.5 mm diameter solder was set on the Ni/Cu/Cr-pad of a Si-substrate. The solder ball on the pad was reflowed with Rosin Mildly Activated (RMA)-flux in air, and the reflow temperature was controlled between 483 K and 533 K. The shear strength and microstructure of the solder ball were evaluated with and without aging. The results show that the shear strength of the Sn-3Ag-8Bi-5In solder ball had the highest value of 1.69N by reflowing at 513 K for 10 s. The shear strength decreased from 1.69N to 0.95N as the IMC thickness was increased from 1.75 μm to 1.9 μm. Needle-shaped Ni₃Sn₄ and plate-like (Ni, Cu)₃Sn₄ formed on the interface between the solder and the Under Bump Metallization (UBM) that was bonded for 10 s at 513 K.

Original language	English
Pages (from-to)	1791-1796
Number of pages	6
Journal	Materials Transactions
Volume	43
Issue number	8
DOIs	https://doi.org/10.2320/matertrans.43.1791
State	Published - Aug 2002

Keywords

Inter-metallic compound
Joint strength
Microstructure
Pb-free solder
Sn-3Ag-8Bi-5In

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10.2320/matertrans.43.1791

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title = "Shear strength and interfacial compound of Sn-Ag-Bi-In alloy",

abstract = "Sn-3Ag-8Bi-5In solder (melting point, 461-477 K) was investigated as a lead(Pb)-free solder. In order to evaluate the solderability of the Sn-Ag-Bi-In alloy, the shear strength of soldered joint and inter-metallic compound (IMC) were investigated. As an experimental procedure, a 0.5 mm diameter solder was set on the Ni/Cu/Cr-pad of a Si-substrate. The solder ball on the pad was reflowed with Rosin Mildly Activated (RMA)-flux in air, and the reflow temperature was controlled between 483 K and 533 K. The shear strength and microstructure of the solder ball were evaluated with and without aging. The results show that the shear strength of the Sn-3Ag-8Bi-5In solder ball had the highest value of 1.69N by reflowing at 513 K for 10 s. The shear strength decreased from 1.69N to 0.95N as the IMC thickness was increased from 1.75 μm to 1.9 μm. Needle-shaped Ni3Sn4 and plate-like (Ni, Cu)3Sn4 formed on the interface between the solder and the Under Bump Metallization (UBM) that was bonded for 10 s at 513 K.",

keywords = "Inter-metallic compound, Joint strength, Microstructure, Pb-free solder, Sn-3Ag-8Bi-5In",

author = "Kim, {Moon Il} and Moon, {Joon Kwon} and Jung, {Jae Pil}",

year = "2002",

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N2 - Sn-3Ag-8Bi-5In solder (melting point, 461-477 K) was investigated as a lead(Pb)-free solder. In order to evaluate the solderability of the Sn-Ag-Bi-In alloy, the shear strength of soldered joint and inter-metallic compound (IMC) were investigated. As an experimental procedure, a 0.5 mm diameter solder was set on the Ni/Cu/Cr-pad of a Si-substrate. The solder ball on the pad was reflowed with Rosin Mildly Activated (RMA)-flux in air, and the reflow temperature was controlled between 483 K and 533 K. The shear strength and microstructure of the solder ball were evaluated with and without aging. The results show that the shear strength of the Sn-3Ag-8Bi-5In solder ball had the highest value of 1.69N by reflowing at 513 K for 10 s. The shear strength decreased from 1.69N to 0.95N as the IMC thickness was increased from 1.75 μm to 1.9 μm. Needle-shaped Ni3Sn4 and plate-like (Ni, Cu)3Sn4 formed on the interface between the solder and the Under Bump Metallization (UBM) that was bonded for 10 s at 513 K.

AB - Sn-3Ag-8Bi-5In solder (melting point, 461-477 K) was investigated as a lead(Pb)-free solder. In order to evaluate the solderability of the Sn-Ag-Bi-In alloy, the shear strength of soldered joint and inter-metallic compound (IMC) were investigated. As an experimental procedure, a 0.5 mm diameter solder was set on the Ni/Cu/Cr-pad of a Si-substrate. The solder ball on the pad was reflowed with Rosin Mildly Activated (RMA)-flux in air, and the reflow temperature was controlled between 483 K and 533 K. The shear strength and microstructure of the solder ball were evaluated with and without aging. The results show that the shear strength of the Sn-3Ag-8Bi-5In solder ball had the highest value of 1.69N by reflowing at 513 K for 10 s. The shear strength decreased from 1.69N to 0.95N as the IMC thickness was increased from 1.75 μm to 1.9 μm. Needle-shaped Ni3Sn4 and plate-like (Ni, Cu)3Sn4 formed on the interface between the solder and the Under Bump Metallization (UBM) that was bonded for 10 s at 513 K.

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Shear strength and interfacial compound of Sn-Ag-Bi-In alloy

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