Sn-3.0Ag-0.5Cu Solder Enriched with Tb4O7 Nanoparticles for Mini-Light Emitting Diode Packaging
- Ashutosh Sharma
- , Seung Jun Hwang
- , Jae Pil Jung
- Ajou University
- Amity University, Jharkhand
- University of Seoul
- SK Corporation
Research output: Contribution to journal › Article › peer-review
5
Scopus
citations