Skip to main navigation Skip to search Skip to main content

Sn-Ag-Cu to Cu joint current aging test and evolution of resistance and microstructure

  • Di Erick Xu
  • , Jasper Chow
  • , Michael Mayer
  • , Jae Pil Jung
  • , Jong Hyun Yoon
  • University of Waterloo
  • KDone Co. Ltd.

Research output: Contribution to journal › Article › peer-review

9 Scopus citations

Fingerprint

Dive into the research topics of 'Sn-Ag-Cu to Cu joint current aging test and evolution of resistance and microstructure'. Together they form a unique fingerprint.
Sort by

Material Science

Engineering