Stencil printing behavior of lead-free Sn-3Ag-0.5Cu solder paste for wafer level bumping for Sub-100 μm size solder bumps

Engineering

• Solder Bump 100%
• Size Distribution 100%
• Electronics 50%
• Low Cost 50%
• Joints (Structural Components) 50%
• Defects 50%
• Assembly 50%
• Throughput 50%
• Particle Size 50%
• Interconnects 50%
• Electronic Devices 50%

Material Science

• Soldering Alloys 100%
• Solder Joint 50%
• Electronic Device 50%
• Electronic Component 50%
• Fine Particle 50%