TY - JOUR
T1 - Three-Dimensional Resistive Random-Access Memory Based on Stacked Double-Tip Silicon Nanowires for Neuromorphic Systems
AU - Lee, Won Joo
AU - Kim, Boram
AU - Koo, Minsuk
AU - Kim, Yoon
N1 - Publisher Copyright:
© 2024 The Authors. Published by American Chemical Society.
PY - 2024/4/23
Y1 - 2024/4/23
N2 - Resistive random-access memory (RRAM) has garnered attention as a synaptic device for neuromorphic systems. However, RRAM typically suffers from various issues, such as a high-forming voltage and significant variation in switching behaviors. To address these, we propose three-dimensional-stacked RRAM based on stacked double-tip Si nanowires. Sharp-tipped Si electrodes reduce the switching voltage through the field concentration effect and minimize cycle-to-cycle variation by effectively controlling the location of conductive filament formation. Additionally, our analysis explored how these benefits enhance the accuracy of neuromorphic systems. In pattern recognition tasks using the Modified National Institute of Standards and Technology database, we achieved an accuracy of 85%, which is 47% higher compared with that of devices that do not utilize the double-tip structure.
AB - Resistive random-access memory (RRAM) has garnered attention as a synaptic device for neuromorphic systems. However, RRAM typically suffers from various issues, such as a high-forming voltage and significant variation in switching behaviors. To address these, we propose three-dimensional-stacked RRAM based on stacked double-tip Si nanowires. Sharp-tipped Si electrodes reduce the switching voltage through the field concentration effect and minimize cycle-to-cycle variation by effectively controlling the location of conductive filament formation. Additionally, our analysis explored how these benefits enhance the accuracy of neuromorphic systems. In pattern recognition tasks using the Modified National Institute of Standards and Technology database, we achieved an accuracy of 85%, which is 47% higher compared with that of devices that do not utilize the double-tip structure.
KW - 3D-stacked
KW - artificial intelligence
KW - artificial neural networks
KW - neuromorphic computing
KW - RRAM
UR - http://www.scopus.com/inward/record.url?scp=85189776436&partnerID=8YFLogxK
U2 - 10.1021/acsaelm.3c01680
DO - 10.1021/acsaelm.3c01680
M3 - Article
AN - SCOPUS:85189776436
SN - 2637-6113
VL - 6
SP - 2232
EP - 2241
JO - ACS Applied Electronic Materials
JF - ACS Applied Electronic Materials
IS - 4
ER -