Three-dimensional simulations of the curing step in the resin transfer molding process

Mi Ae Choi, Mi Hye Lee, Jaeeon Chang, Seung Jong Lee

Research output: Contribution to journalArticlepeer-review

12 Scopus citations


The curing step in resin transfer molding process involves heat transfer coupled with the curing reaction of thermoset resin. In order to examine the curing behavior under a specified cure cycle in the resin transfer molding process, numerical simulations are carried out by three-dimensional finite element method. An experimental study for isothermal cure kinetics of epoxy resin is conducted by using differential scanning calorimetry. Kinetic parameters based on the modified Kamal model are determined from the calorimetric data for the epoxy system, and by using these parameters, numerical simulations are performed for a hat-shaped mold. It is found from the simulation results that the temperature profile and the degree of cure are well predicted for the region inside the mold. This numerical study can provide a systematic tool in the curing process to find an optimum cure cycle and a uniform distribution of the degree of cure.

Original languageEnglish
Pages (from-to)543-552
Number of pages10
JournalPolymer Composites
Issue number4
StatePublished - Aug 1999


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