@inproceedings{a899f06a5254420aa5f913175c38e48f,
title = "Topology optimization of ultrasonic transducers for microsystem and IC packaging",
abstract = "In this study, we introduce the method of topology optimization for ultrasonic transducers for flip-chip and wire bonding. The objective function of topology optimization is prepared with shifting the resonance frequency for a longitudinal vibration mode of the transducers. After comparing solid isotropic material with penalization (SIMP) method with rational approximation of material properties (RAMP) on 2D model which is used to formulate topology optimization, we optimize 3D model based on results of 2D models. The topology optimization schemes are implemented by MATLAB, and the finite element models are established and the resonance frequency and modes are calculated in COMSOL. The target longitudinal mode at the resonance frequency is tracked using weighted modal assurance criterion (WMAC). Considering the availability of the new design, we manufacture and test the prototype of ultrasonic transducers based on the 3D optimization result.",
keywords = "Flip-chip bonding, Topology optimization, Ultrasonic transducer, Wire bonding",
author = "Kim, {Ji Soo} and Kim, {Jong Min} and Lee, {Soo Il} and Lim, {Eun Jae}",
year = "2012",
language = "English",
isbn = "9781466562752",
series = "Technical Proceedings of the 2012 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2012",
pages = "79--82",
booktitle = "Nanotechnology 2012",
note = "Nanotechnology 2012: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - 2012 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2012 ; Conference date: 18-06-2012 Through 21-06-2012",
}