Abstract
In this paper, a novel transient liquid phase bonding material was fabricated by consequent electroless plating of Cu and Sn on a multi-walled carbon nanotube (MWCNT). The resulting Sn-Cu-MWCNT composites were used to join the Cu interconnects at 260°C. After 8 min of reflow time, a complete transformation of Cu3Sn intermetallic compound (IMC) occurred, leaving a Cu/MWCNT-Cu3Sn /Cu joint capable of withstanding the high operating temperature. Due to flake-like morphology, the Sn-Cu-MWCNT composite particles were well packed with lesser voids. The shear strength of the Cu/Cu3Sn-MWCNT/Cu joint was measured as 35.3 MPa, thus exhibiting the scope for replacing conventional transient liquid phase (TLP) powders in the future.
Original language | English |
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Article number | 529 |
Journal | Applied Sciences (Switzerland) |
Volume | 9 |
Issue number | 3 |
DOIs | |
State | Published - 4 Feb 2019 |
Keywords
- CuSn-multi-walled carbon nanotube
- Shear test
- Transient liquid phase (TLP) bonding