Transient liquid phase bonding of copper using Sn coated Cu MWCNT composite powders for power electronics

Sri Harini Rajendran, Do Hyun Jung, Wook Sang Jeon, Jae Pil Jung

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8 Scopus citations

Abstract

In this paper, a novel transient liquid phase bonding material was fabricated by consequent electroless plating of Cu and Sn on a multi-walled carbon nanotube (MWCNT). The resulting Sn-Cu-MWCNT composites were used to join the Cu interconnects at 260°C. After 8 min of reflow time, a complete transformation of Cu3Sn intermetallic compound (IMC) occurred, leaving a Cu/MWCNT-Cu3Sn /Cu joint capable of withstanding the high operating temperature. Due to flake-like morphology, the Sn-Cu-MWCNT composite particles were well packed with lesser voids. The shear strength of the Cu/Cu3Sn-MWCNT/Cu joint was measured as 35.3 MPa, thus exhibiting the scope for replacing conventional transient liquid phase (TLP) powders in the future.

Original languageEnglish
Article number529
JournalApplied Sciences (Switzerland)
Volume9
Issue number3
DOIs
StatePublished - 4 Feb 2019

Keywords

  • CuSn-multi-walled carbon nanotube
  • Shear test
  • Transient liquid phase (TLP) bonding

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