Transient liquid phase bonding of copper using Sn coated Cu MWCNT composite powders for power electronics

Sri Harini Rajendran; Do Hyun Jung; Wook Sang Jeon; Jae Pil Jung

doi:10.3390/app9030529

Transient liquid phase bonding of copper using Sn coated Cu MWCNT composite powders for power electronics

Sri Harini Rajendran
, Do Hyun Jung
, Wook Sang Jeon
, Jae Pil Jung

Department of Materials Science and Engineering

University of Seoul
Lightweight Materials Technology Center

Research output: Contribution to journal › Article › peer-review

16 Scopus citations

Abstract

In this paper, a novel transient liquid phase bonding material was fabricated by consequent electroless plating of Cu and Sn on a multi-walled carbon nanotube (MWCNT). The resulting Sn-Cu-MWCNT composites were used to join the Cu interconnects at 260°C. After 8 min of reflow time, a complete transformation of Cu₃Sn intermetallic compound (IMC) occurred, leaving a Cu/MWCNT-Cu3Sn /Cu joint capable of withstanding the high operating temperature. Due to flake-like morphology, the Sn-Cu-MWCNT composite particles were well packed with lesser voids. The shear strength of the Cu/Cu₃Sn-MWCNT/Cu joint was measured as 35.3 MPa, thus exhibiting the scope for replacing conventional transient liquid phase (TLP) powders in the future.

Original language	English
Article number	529
Journal	Applied Sciences (Switzerland)
Volume	9
Issue number	3
DOIs	https://doi.org/10.3390/app9030529
State	Published - 4 Feb 2019

Keywords

CuSn-multi-walled carbon nanotube
Shear test
Transient liquid phase (TLP) bonding

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10.3390/app9030529

Cite this

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title = "Transient liquid phase bonding of copper using Sn coated Cu MWCNT composite powders for power electronics",

abstract = "In this paper, a novel transient liquid phase bonding material was fabricated by consequent electroless plating of Cu and Sn on a multi-walled carbon nanotube (MWCNT). The resulting Sn-Cu-MWCNT composites were used to join the Cu interconnects at 260°C. After 8 min of reflow time, a complete transformation of Cu3Sn intermetallic compound (IMC) occurred, leaving a Cu/MWCNT-Cu3Sn /Cu joint capable of withstanding the high operating temperature. Due to flake-like morphology, the Sn-Cu-MWCNT composite particles were well packed with lesser voids. The shear strength of the Cu/Cu3Sn-MWCNT/Cu joint was measured as 35.3 MPa, thus exhibiting the scope for replacing conventional transient liquid phase (TLP) powders in the future.",

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author = "Rajendran, \{Sri Harini\} and Jung, \{Do Hyun\} and Jeon, \{Wook Sang\} and Jung, \{Jae Pil\}",

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AU - Rajendran, Sri Harini

AU - Jung, Do Hyun

AU - Jeon, Wook Sang

AU - Jung, Jae Pil

PY - 2019/2/4

Y1 - 2019/2/4

N2 - In this paper, a novel transient liquid phase bonding material was fabricated by consequent electroless plating of Cu and Sn on a multi-walled carbon nanotube (MWCNT). The resulting Sn-Cu-MWCNT composites were used to join the Cu interconnects at 260°C. After 8 min of reflow time, a complete transformation of Cu3Sn intermetallic compound (IMC) occurred, leaving a Cu/MWCNT-Cu3Sn /Cu joint capable of withstanding the high operating temperature. Due to flake-like morphology, the Sn-Cu-MWCNT composite particles were well packed with lesser voids. The shear strength of the Cu/Cu3Sn-MWCNT/Cu joint was measured as 35.3 MPa, thus exhibiting the scope for replacing conventional transient liquid phase (TLP) powders in the future.

AB - In this paper, a novel transient liquid phase bonding material was fabricated by consequent electroless plating of Cu and Sn on a multi-walled carbon nanotube (MWCNT). The resulting Sn-Cu-MWCNT composites were used to join the Cu interconnects at 260°C. After 8 min of reflow time, a complete transformation of Cu3Sn intermetallic compound (IMC) occurred, leaving a Cu/MWCNT-Cu3Sn /Cu joint capable of withstanding the high operating temperature. Due to flake-like morphology, the Sn-Cu-MWCNT composite particles were well packed with lesser voids. The shear strength of the Cu/Cu3Sn-MWCNT/Cu joint was measured as 35.3 MPa, thus exhibiting the scope for replacing conventional transient liquid phase (TLP) powders in the future.

KW - CuSn-multi-walled carbon nanotube

KW - Shear test

KW - Transient liquid phase (TLP) bonding

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DO - 10.3390/app9030529

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AN - SCOPUS:85060968532

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IS - 3

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ER -

Transient liquid phase bonding of copper using Sn coated Cu MWCNT composite powders for power electronics

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Keywords

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