Fingerprint
Dive into the research topics of 'Transient liquid phase bonding of copper using Sn coated Cu MWCNT composite powders for power electronics'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Transient liquid phase bonding of copper using Sn coated Cu MWCNT composite powders for power electronics
Sri Harini Rajendran, Do Hyun Jung, Wook Sang Jeon, Jae Pil Jung
Research output: Contribution to journal › Article › peer-review
10
Scopus
citations