Transient liquid phase bonding of copper using Sn coated Cu MWCNT composite powders for power electronics
- Sri Harini Rajendran
- , Do Hyun Jung
- , Wook Sang Jeon
- , Jae Pil Jung
- University of Seoul
- Lightweight Materials Technology Center
Research output: Contribution to journal › Article › peer-review
16
Scopus
citations