Skip to main navigation Skip to search Skip to main content

Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties

  • University of Seoul

Research output: Contribution to journal › Article › peer-review

37 Scopus citations

Fingerprint

Dive into the research topics of 'Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties'. Together they form a unique fingerprint.
Sort by

Material Science