TY - GEN
T1 - Ultrasonic dispersion of nanocomposite solder for microelectronic packaging
AU - Rajendran, Sri Harini
AU - Kang, Hyejun
AU - Seo, Seong Min
AU - Jung, Jae Pil
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - With the progress in miniaturization and portability of consumer electronics, devices are expected to be compact and lightweight, demanding more input-output electrical transfer in less space via fine-pitch interconnections. The solder ball diameter used in the ball grid array (BGA) and Flip-chip ball grid array (FCBGA) for joining the integrated circuits, microprocessors, memory chips, etc., to printed circuit boards (PCB) is continuously downsized to meet the current market demands [1, 2].
AB - With the progress in miniaturization and portability of consumer electronics, devices are expected to be compact and lightweight, demanding more input-output electrical transfer in less space via fine-pitch interconnections. The solder ball diameter used in the ball grid array (BGA) and Flip-chip ball grid array (FCBGA) for joining the integrated circuits, microprocessors, memory chips, etc., to printed circuit boards (PCB) is continuously downsized to meet the current market demands [1, 2].
UR - http://www.scopus.com/inward/record.url?scp=85144029626&partnerID=8YFLogxK
U2 - 10.1109/IMPACT56280.2022.9966718
DO - 10.1109/IMPACT56280.2022.9966718
M3 - Conference contribution
AN - SCOPUS:85144029626
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
BT - Proceedings - 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022
PB - IEEE Computer Society
T2 - 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022
Y2 - 26 October 2022 through 28 October 2022
ER -