Understanding the role of additional Cu intercalation in electronic and thermal properties of p-type Cu2.9Te2-incorporated Bi0.5Sb1.5Te3 thermoelectric alloys

Hyunjin Park, Mujde Yahyaoglu, Sang il Kim, Seong Mee Hwang, Kivanc Saglik, Sefa Oztulum, Se Yun Kim, Kyu Hyoung Lee, Umut Aydemir, Hyun Sik Kim

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