@inproceedings{86b0481b11d14732ac26d727890ef4db,
title = "Usb Type-C Receptacle Connector with Ceramic Insulator and Three-Layer Ground Plates",
abstract = "This paper proposes a novel USB Type-C receptacle connector with a ceramic insulator and three-layer ground plates. In the conventional manufacturing method involving injection molding process, multi-layer ground plates cannot be realized, and a single ground plate must include open areas for injection molding fixation and silicone potting. The defected metal ground plate may leak RFI. Hybrid Integrated circuit (HIC) processes and high-temperature co-fired ceramic (HTCC) technology used in this work enable the implementation of three metal plates and the use of ceramics. The three metal plates result in a reduction of RFI by up to 4.7 dB for RX1 and 10 dB for TX1 across the frequency range of 0.5 to 3 GHz compared with the commercial USB Type-C receptacle connector. The use of alumina ceramic demonstrated excellent reliability, with the extraction force measured at 1.82 kg f initially and 1.78 kg f after 20,000 cycles of insertion and extraction.",
keywords = "ceramic, durability, electromagnetic compatibility (EMC), multi-layer ground, radio frequency interference (RFI), reliability, USB Type-C",
author = "Park, \{Jeong Hun\} and Lee, \{Chung Seok\} and Jang, \{Jin Man\} and Yun, \{Seon Hwa\} and Choi, \{Jae Hyuk\} and Lee, \{Moon Que\}",
note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 2025 IEEE/MTT-S International Microwave Symposium, IMS 2025 ; Conference date: 15-06-2025 Through 20-06-2025",
year = "2025",
doi = "10.1109/IMS40360.2025.11103857",
language = "English",
series = "IEEE MTT-S International Microwave Symposium Digest",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "970--973",
booktitle = "2025 IEEE/MTT-S International Microwave Symposium, IMS 2025",
address = "United States",
}