Wetting property and reflectivity of Sn-3.5Ag solder by plating for LED lead frame

Se Ho Kee, Zengfeng Xu, Won Joong Kim, Jae Pil Jung

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

The wetting property and reflectivity of Sn-3.5Ag solder which was dip coated on a LED lead frame were investigated. The wettability of molten solder on Cu substrate was evaluated by the wetting balance tester, and surface tension was calculated from maximum withdrawal force and withdrawal time. Temperature of the molten solder in a bath was varied in the range of 250-290°C. With increasing temperature, the surface tension decreased a little. The reflectivity of Sn-3.5Ag coated on a substrate became a little lower than the highest current LED lead frame reflectivity.

Original languageEnglish
Pages (from-to)563-568
Number of pages6
JournalJournal of Korean Institute of Metals and Materials
Volume50
Issue number8
DOIs
StatePublished - Aug 2012

Keywords

  • Alloys
  • Reflectivity
  • Soldering
  • Surface roughness
  • Wetting

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